|
|
|
|
|
|
|
|
Automatische und manuelle Fertigung
|
|
|
|
|
|
|
|
|
|
Pilot-run series, small
series and large-lot production
|
|
|
|
|
Fully automatic SMD-line
production
|
|
|
|
|
Component spectrum 0402
to QFP 336 edge length 32 mm
|
|
|
|
|
BGA technology with 2-D
inspection
|
|
|
|
|
Lead Pitch up to 0,4 mm
|
|
|
|
|
Usable length L 457 mm x
B 407 mm
|
|
|
|
|
Output up to 100,000 SMD components per hour
|
|
|
|
|
Full convection reflow
soldering with ten heating zones for double-sided SMD soldering
|
|
|
|
|
Hand assembly (fine
soldering)
|
|